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Open Circuit Cooling Tower Pvc Fills

Open Circuit Cooling Tower Pvc Fills

    The film fill is a bottom support low-clog log fill configuration. Open, angular cross corrugations allow debris and biological growth foulant to pass, while providing maximum surface area and turbulence to develop efficient heat transfer. Texturing creates thermal capability improvement with little effect on fouling. The fills offers low pressure drop in an aerodynamic, durable design.